Features:

Housing pre-load designed in to prevent contact bounce and Improve product reliability

Shell spring is added to ensure a good contact with the equipment panel to give increased EMI efficiency

Spring chamfers are included on the top and bottom of the shell to give increased shielding continuity.

A Rib is added to the shell tail to prevent floating when soldering.

DIP tails are increased by 0.50 mm & two slots are added on housing bottom to avoid tin contamination on the shell tails.